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Description
Datasheet Sep. 2005. MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>. PS21564 - P . TRANSFER-MOLD TYPE. INSULATED TYPE. Aug 2, 2009 3.2 Outline differential between Pb-free solder plating type(-P/-AP) and Pb Same parts are changed about PS21562-P, PS21564 - P too. 14 (WPG). 15 VWFB. 16 VP1. 17 (COM). 18 WP. 19 (UNG). 20 VNO. 21 UN. 22 VN. 23 WN. 24 FO. 25 CFO. 26 CIN. 27 VNC. 28 VN1. 29 (WNG). 30 (VNG). 31 P . tion of holes from the P collector region when the element is .. sic junction voltage at the p base-n junction is .. current miniature package product ( PS21564 ). Bip.Tr. Bip.Tr. hFE. Bip.Tr. Bip.Tr. hFE. IGBT. Eoff. VCE(sat). CSTBTTM n p+ p n+ n well n well n well n well p+ p n+ n+ p p substrate. E. E source gate drain.
| Part Number | PS21564P |
| Main Category | Discrete Semiconductor Products |
| Sub Category | Power Driver Modules |
| Brand | Toshiba |
| Description | MOD IPM 600V 15A MINI DIP |
| Series | Intellimod |
| Type | IGBT |
| Configuration | 3 Phase |
| Current | 15A |
| Voltage | 600V |
| Voltage - Isolation | 2500VDC |
| Package / Case | 35-PowerDIP Module (1.370", 34.80mm) |
| Image |  |
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